I-BOND TOTAL ETCH VALUE PACK (3/PK) PATTERSON This system operates using SmartMode™

This system operates using SmartMode™ Technology

minimal polymerization shrinkage and extremely low solubility

Contains: 5 (2

Kerr Applicators are flexible and bendable

I-BOND TOTAL ETCH VALUE PACK (3/PK) PATTERSON This system operates using SmartMode™iBOND Total Etch is an Etch & Rinse 2 step bonding system from Heraeus. Due to the innovative nano filler technology, iBOND Total Etch not only attains high bond strengths to both enamel and dentin, but also ensures optimal marginal adaptation and is ideal for desensitizing hypersensitive areas. Bonding of direct composite restorations Bonding of indirect restorations Treatment of hypersensitive tooth areas